- Departments / Centres
Functions of an Electronic Package, Packaging Hierarchy, IC packaging: MEMS packaging, consumer electronics packaging, medical electronics packaging, Trends, Challenges, Driving Forces on Packaging Technology, Materials for Microelectronic packaging, Packaging Material Properties, Ceramics, Polymers, and Metals in Packaging, Material for high density interconnect substrates.
Electrical Anatomy of Systems Packaging, Signal Distribution, Power Distribution, Electromagnetic Interference, Design Process Electrical Design: Interconnect Capacitance, Resistance and Inductance fundamentals; Transmission Lines , Clock Distribution, Noise Sources, power Distribution, signal distribution, EMI, Digital and RF Issues. Processing Technologies, Thin Film deposition, Patterning, Metal to Metal joining.
IC Assembly – Purpose, Requirements, Technologies, Wire bonding, Tape Automated Bonding, Flip Chip, Wafer Level Packaging , reliability, wafer level burn – in and test.Single chip packaging : functions, types, materials processes, properties, characteristics, trends.Multi chip packaging : types, design, comparison, trends. Passives: discrete, integrated, embedded –encapsulation and sealing : fundamentals, requirements, materials, processes.
Printed Circuit Board: Anatomy, CAD tools for PCB design, Standard fabrication, Microvia Boards. Board Assembly: Surface Mount Technology, Through Hole Technology, Process Control and Design challenges.Thermal Management, Heat transfer fundamentals, Thermal conductivity and resistance, Conduction, convection and radiation – Cooling requirements.
Reliability, Basic concepts, Environmental interactions. Thermal mismatch and fatigue – failures – thermo mechanically induced – electrically induced – chemically induced. Electrical Testing: System level electrical testing, Interconnection tests, Active Circuit Testing, Design for Testability.
1. Tummala, Rao R., Fundamentals of Microsystems Packaging, McGraw Hill, 2001
1. Blackwell (Ed), The electronic packaging handbook, CRC Press,2000.
2. Tummala, Rao R, Microelectronics packaging handbook, McGraw Hill, 2008.
3. Bosshart, Printed Circuit Boards Design and Technology,TataMcGraw Hill, 1988.
4. R.G. Kaduskar and V.B.Baru, Electronic Product design, Wiley India, 2011
5. R.S.Khandpur, Printed Circuit Board, Tata McGraw Hill, 2005
CO1: Design of PCBs which minimize the EMI and operate at higher frequency.
CO2: Enable design of packages which can withstand higher temperature, vibrations and shock